Thermal Imaging Module with 12μm Pixel Pitch Ultra-Compact 17.3mm Body, Low Power <0.6W, Ideal for Embedded Systems

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Thermal Imaging Module with 12μm Pixel Pitch Ultra-Compact 17.3mm Body, Low Power <0.6W, Ideal for Embedded Systems

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Product Description

Technical Specifications

Model

M3-9.1MM

Sensor Type

Uncooled VOx Focal Plane Array

Resolution

384*288 (Effective FPA)

Pixel Pitch

12μm

Spectral Response

8~14μm

NETD

≤35mk (F/1.0 50Hz 300K)

Frame Rate

50Hz

Focal Length

4mm and 9.1mm

Detection Distance

400m

Power Consumption

<0.6W

Video Interface

CVBS (PAL Format)

Control Interface

UART (Baud Rate: 460800)

Dimensions

21*21*10.3mm

Certifications

CE, FCC, CCC, RoHS, ISO9001

Product Overview

Thermal Imaging Module - M3-C Series

The M3-C Series Thermal Imaging Modules (M3-C-4 and M3-C-9.1) are advanced, compact infrared camera solutions designed for high-sensitivity thermal detection and imaging in a wide range of industrial, security, and surveillance applications. Featuring an uncooled Vanadium Oxide (VOx) Focal Plane Array (FPA) detector, these modules deliver reliable performance with exceptional thermal resolution and low power consumption.

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High Sensitivity

NETD ≤ 35mK and 384×288 resolution for precise temperature measurement and clear imaging in low-contrast scenes.

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Compact Design

Ultra-lightweight (16g) and miniature size (17.3mm × 17.3mm × 35.7mm) ideal for robotics and drones.

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Advanced Processing

Supports pseudo-color modes, 1X-8X digital zoom, and built-in Non-Uniformity Correction (NUC).

Primary Applications

Industrial monitoring, perimeter scanning, inspection robots, fire warning, fire helmets, electro-optical pods, thermal imaging night vision devices, assisted driving, and smart home appliances.

Technical Highlights

Detector Type: Uncooled VOx FPA with 12μm Pixel Pitch.
Dual Lens Options: 4mm (FOV: 59.9°×46.7°) and 9.1mm (FOV: 28.4°×21.5°).
Environmental Durability: Operates from -20°C to +60°C; withstands shock up to 80g.
Flexible Integration: CVBS analog video output and UART control interface.

Physical Characteristics

Weight (without lens)

<8.6g

Module Weight (standard)

16g

Package Size

10.0cm * 10.0cm * 10.0cm

Package Gross Weight

0.180kg

Frequently Asked Questions

What is the resolution of the M3-C series thermal module?

The module features an uncooled VOx FPA detector with an effective resolution of 384×288 pixels.

What are the power requirements for this imaging module?

It supports a wide DC power input range of 4.5V to 27V, with an ultra-low power consumption of less than 0.6W.

What lens configurations are available?

The standard options include a 4mm lens (59.9° FOV) and a 9.1mm lens (28.4° FOV). Custom lenses are also supported.

Which output interfaces are integrated?

The module provides a CVBS analog video interface (PAL format) for imaging and a UART interface for control and calibration.

Does the module support digital zoom?

Yes, it supports digital zoom ranging from 1X to 8X for closer inspection of thermal targets.

Is it suitable for portable or drone applications?

Absolutely. With a total weight of only 16g and a compact footprint, it is designed specifically for space-constrained and weight-sensitive embedded systems.

Product Detail

Thermal Imaging Module with 12μm Pixel Pitch Ultra-Compact 17.3mm Body, Low Power <0.6W, Ideal for Embedded Systems

Product Description

Technical Specifications